1. 2. 3. material content data sheet sales product name ipb65r225c7 issued 29. august 2013 ma# MA001043902 package pg-to263-3-2 weight* 1558.61 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.621 0.23 0.23 2323 2323 leadframe non noble metal iron 7439-89-6 0.304 0.02 195 inorganic material phosphorus 7723-14-0 0.091 0.01 59 non noble metal copper 7440-50-8 304.026 19.51 19.54 195061 195315 wire non noble metal aluminium 7429-90-5 2.582 0.17 0.17 1656 1656 encapsulation organic material carbon black 1333-86-4 10.298 0.66 6607 plastics epoxy resin - 113.277 7.27 72678 inorganic material silicondioxide 60676-86-0 562.953 36.10 44.03 361188 440474 leadfinish non noble metal tin 7440-31-5 9.657 0.62 0.62 6196 6196 plating non noble metal nickel 7440-02-0 0.228 0.01 147 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 147 solder noble metal silver 7440-22-4 0.080 0.01 51 non noble metal tin 7440-31-5 0.064 0.00 41 non noble metal lead 7439-92-1 3.055 0.20 0.21 1960 2052 heatspreader inorganic material phosphorus 7723-14-0 0.165 0.01 106 non noble metal iron 7439-89-6 0.548 0.04 352 non noble metal copper 7440-50-8 547.666 35.14 35.19 351379 351837 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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